Huawei has publicly released the latest chip packaging patent, which is beneficial for improving chip performance

Huawei publicly releases latest chip packaging patent to enhance chip performance

【phoneauto News】Recently, Huawei has publicly disclosed a chip packaging patent that helps improve chip performance. According to the Enterprise Check APP, Huawei Technologies Co., Ltd. has applied for a patent called “A Chip Packaging and Method for Preparing Chip Packaging”.

According to phoneauto, the application date of this patent is December 16, 2020, and the publication date is August 4, 2023, with the publication number CN116547791A. The inventors are Hu Xiao and Zhao Nan.

Patent-related information (image source from Enterprise Check)

According to the abstract of this patent, the present application provides a method for preparing chip packaging and chip packaging, which helps improve chip performance. The chip packaging includes a substrate, a bare chip, a first protective structure, and a barrier structure. The bare chip, the first protective structure, and the barrier structure are all set on the first surface of the substrate. The first protective structure wraps around the side of the bare chip, and the barrier structure wraps around the first protective structure away from the surface of the bare chip. The first surface of the bare chip, the first surface of the first protective structure, and the first surface of the barrier structure are all flush with each other. Among them, the first surface of the bare chip is the surface of the bare chip away from the substrate, the first surface of the first protective structure is the surface of the first protective structure away from the substrate, and the first surface of the barrier structure is the surface of the barrier structure away from the substrate.

Patent principle diagram (image source from Enterprise Check)

It is reported that as of the end of 2022, Huawei holds over 120,000 valid authorized patents, mainly distributed in China, Europe, America, Asia-Pacific, the Middle East, and Africa. Among them, Huawei holds over 40,000 patents in China and Europe, and over 22,000 patents in the United States.

We will continue to update Phone&Auto; if you have any questions or suggestions, please contact us!


Was this article helpful?

93 out of 132 found this helpful

Discover more


Redmi K70 Pro goes on sale today, powered by Snapdragon 8 Gen 3, offering an extremely high cost-performance ratio.

[Mobile China News] Recently, Redmi held a new product launch conference and officially introduced the Redmi K70 Pro....


Japanese media reports claim that the iPhone 15 is facing tough competition in China, as Huawei's offensive is fierce and Meta ramps up production.

[Mobile China News] On October 20th, Mobile China noticed that the Nikkei Chinese website reported that the productio...


Huawei is reportedly clearing out inventory of Snapdragon models and will soon switch to a new product line!

【Mobile China News】Previously, unlike most other mobile phone manufacturers, a large number of Huawei models used t...


Huawei responds to the rebranding of HuaBianPay Essentially speeding up the construction of the HarmonyOS ecosystem.

【Mobile China News】On October 13th, the People's Bank of China officially announced that Huawei's payment instituti...


Huawei reportedly applied for multiple communication patents, effectively reducing beam management time.

[Mobile China News] On December 13th, according to an announcement by the National Intellectual Property Office, Huaw...


Breaking News Huawei and Meituan Reach Cooperation Agreement, Officially Launch Hongmeng Native App Development.

【Mobile China News】On November 13th, Mobile China noticed that Huawei announced a comprehensive partnership with Me...