MediaTek announces 3nm Dimensity flagship chip successfully taped out, mass production next year
MediaTek successfully taped out its flagship 3nm Dimensity chip, with mass production scheduled for next year
【Phoneauto News】On September 7th, according to official news from MediaTek, the company announced jointly with TSMC today that the development progress of MediaTek’s first flagship chip produced using TSMC’s 3nm process is going smoothly. It has successfully taped out recently and is expected to start mass production in 2024 and officially launch in the second half of the year. Based on the timing, this flagship chip is not the Dimensity 9300 that was launched this year.
It is reported that TSMC’s 3nm process technology not only provides complete platform support for high-performance computing and mobile applications but also has enhanced performance, power consumption, and yield. Compared with the 5nm process, the logic density of TSMC’s 3nm process technology increases by about 60%, the speed increases by 18% under the same power consumption, or the power consumption decreases by 32% at the same speed.
In response, MediaTek CEO Chen Guanzhou said, “MediaTek is committed to using the world’s most advanced technology to create cutting-edge technology products for users and enhance and enrich people’s lives as part of our strategy to expand the global flagship market. TSMC’s stable and high-quality manufacturing capabilities allow MediaTek’s outstanding designs in flagship chips to be fully demonstrated, providing the best chip solution with high performance, high energy efficiency, and stable quality to global customers, bringing unprecedented user experience to the flagship market.”
- The Wall Street Journal Chinese government officials are not allowed to use iPhones Is Apple having a tough year?
- OPPO’s design is truly exquisite You won’t be able to forget this Find N3 Flip at first sight
- Foldable screens can’t be the main machine? Xiaomi MIX Fold 3 will prove it with its strength
TSMC also stated, “Over the years, TSMC has closely collaborated with MediaTek, bringing many significant innovations to the market. We are also honored to continue to cooperate in the 3nm and more advanced technologies. TSMC and MediaTek’s collaboration on the Dimensity flagship chip brings the semiconductor industry’s top process technology to mobile terminals such as smartphones, allowing global users to enjoy unparalleled user experience.”
We will continue to update Phone&Auto; if you have any questions or suggestions, please contact us!
Was this article helpful?
93 out of 132 found this helpful
Related articles
- Now, if you want to buy a foldable screen smartphone, I recommend these several models They are all from well-known brands and provide more security
- Exposure of iPhone 15 Pro Max imaging parameters The 85mm telephoto lens produces amazing images
- Guo Mingqi Qualcomm is the main loser, SoC shipments will be reduced by 60 million units next year
- Morning News iPhone 15’s Super Large Camera Revealed, BYD’s Dolphin DM-i Goes on Sale
- This realme smartphone is the best-selling smartphone in India priced below 10,000 Indian Rupees
- A company in Shenzhen encourages employees to purchase Huawei Mate60 The company will reimburse half of the cost
- US consultant responds to the release of Huawei Mate60 Pro Technology restrictions should continue