Xiaomi is warming up! Civi 3 will be the world’s first to launch with the Tianji 8200 Ultra imaging chip

Xiaomi's Civi 3 will be the first in the world to launch with Tianji 8200 Ultra imaging chip

【PhoneAuto News】Currently, after years of heavy investment, Xiaomi has become one of the smartphone manufacturers with the strongest image capabilities in the smart phone industry today. For example, the recently released Xiaomi 13 Ultra is equipped with an imaging system that includes a one-inch large bottom main camera and three 50-megapixel sub-cameras, making it the preferred choice for countless photography enthusiasts when purchasing smartphones. And now, we are about to welcome the release of Xiaomi Civi 3. Based on the performance of the previous generations of Civi models, Xiaomi Civi 3 should also perform quite well in portrait photography.

On May 18th, PhoneAuto noticed that Xiaomi officially announced that Xiaomi Civi 3 will globally debut the Dimensity 8200 Ultra processor from MediaTek. According to the introduction, Dimensity 8200 Ultra is not only a high-performance chip but also an imaging talent chip tailored for Xiaomi Civi 3. This will be the first time that the Xiaomi imaging brain is fully adapted and accelerated with the Dimensity mobile platform!

From the naming, Dimensity 8200 Ultra should be an improved version of Dimensity 8200. According to relevant information, Dimensity 8200 is built on TSMC’s 4nm process, with an eight-core CPU design, including a 3.1GHz Cortex-A78 ultra-large core, three 3.0GHz Cortex-A78 large cores, and four 2.0GHz Cortex-A55 small cores. At the same time, the GPU of this processor is Mali-G610. On the Geekbench 5 platform, Dimensity 8200 is significantly better than Snapdragon 870, and Dimensity 8200 Ultra should perform even better in terms of performance.

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