Snapdragon 8 Gen3 to be released as early as October 24th! Confirmed by Qualcomm Technology Summit

Snapdragon 8 Gen3 confirmed to release on October 24th by Qualcomm Technology Summit

【PhoneAuto News】On June 2nd, Qualcomm announced on its overseas social media platform that the 2023 Snapdragon Tech Summit will be held in Hawaii from October 24th to 26th. Qualcomm is expected to release a brand new Snapdragon 8 Gen3 mobile platform at the event.

Qualcomm officially announces the 2023 Snapdragon Tech Summit

The Snapdragon 8 Gen3 is earlier than in previous years. Last year’s Snapdragon Tech Summit was held in mid-November. It is reported that the first batch of smartphones equipped with the Snapdragon 8 Gen3 mobile platform will be launched in November, including the Xiaomi 14 series with outstanding design experience, the vivo X100 series with breakthrough imaging, the iQOO12 series, the Redmi K70 series, the OnePlus 12, and the realme GT5.

Related leaks

It is understood that compared with the second-generation Snapdragon 8 mobile platform, the third-generation Snapdragon 8 mobile platform has one more large core and one less small core. The ultra-large core has been upgraded to Cortex X4, with a maximum frequency of up to 3.72GHz, and the performance will be improved by 15%-20%. The GPU part may be upgraded to the highest frequency. The Adreno 750 can reach 770MHz, and the Antutu score can reach 1.6 million points, far exceeding the 1.34 million points of the second-generation Snapdragon 8 mobile platform. In addition, in the GFX ES3.1 test, the third-generation Snapdragon 8 mobile platform scored 280FPS, while the second-generation Snapdragon 8 mobile platform scored 220FPS.

Leaked information indicates that the Xiaomi 14 may use an ultra-narrow small straight screen, equipped with the third-generation Snapdragon 8 mobile platform, a 50 million pixel ultra-large bottom main camera + upright small telephoto lens. In addition to being equipped with the third-generation Snapdragon 8 mobile platform, the vivo X100 series will also debut the Dimensity 9300. The Dimensity 9300 is likely to be unveiled before the Snapdragon 8 Gen3.

The Tianji 9300 will also use TSMC’s N4P process and adopt a “4+4” architecture. Currently, the sample scheduling is still “1+3+4”, consisting of 1 high-frequency super large core X4, 3 medium-frequency super large cores X4m, and 4 low-frequency large cores A720. Its benchmark score is higher than that of the Snapdragon 8 Gen3, and its energy consumption is yet to be determined.

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