Full-screen without holes is making a comeback! It is reported that the Xiaomi MIX Fold 3 may be released during the summer
Xiaomi MIX Fold 3 with full-screen without holes may be released this summer
【PhoneAuto News】During the current downturn of the entire mobile phone market, only the foldable screen phone category is rising against the trend. It can be said that the current foldable screen models have become the next trend in the global smartphone market. Recently, there are rumors that Xiaomi MIX Fold 3 may be released during this year’s summer vacation, and is expected to be officially launched in July or August. The biggest difference between Xiaomi MIX Fold 3 and its predecessor is that it uses under-screen camera technology, which will become Xiaomi’s first foldable screen phone to use this technology.
According to PhoneAuto, to hide the camera under the screen, the light must pass through the screen, so it is necessary to “hide” the circuit under the screen. Therefore, Xiaomi added a transition zone between the CUP area and the normal display area, supplemented by self-developed DDIC tuning algorithm and color calibration, which not only ensures transparency but also ensures display effect.
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In addition, in order to further improve the light intake and the shooting effect of the under-screen camera, Xiaomi changed the wire connecting the pixel and the drive circuit to ITO transparent indium tin oxide material, and changed the original straight transparent lead to a wavy line to control the diffraction of the transparent lead.
In terms of software, Xiaomi has also targeted optimization of point spread correction algorithms, multi-frame noise reduction algorithms, sharpening algorithms, and automatic white balance algorithms, so that the imaging of the under-screen camera can be comparable to that of a punch-hole screen. In terms of hardware, Xiaomi MIX Fold 3 will use the second-generation Snapdragon 8 mobile platform from Qualcomm and will be equipped with Leica imaging, with a model number of 2308CPXD0C.
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